Impact of aluminum wire and ribbon bonding technologies on D2PAK package reliability during thermal cycling applications

About the author

Dr. Sébastien Jacques received the Ph.D. degree in electrical engineering from University of Tours, Tours, France, in 2010. Between 2010 and 2012, Dr. Sébastien Jacques worked as Product Quality Engineer for STMicroelectronics Tours SAS. Since 2012, he has been with the Research Group on Materials, Microelectronics, Acoustics and Nanotechnologies (GREMAN CNRS UMR 7347), where he has been hired as an Assistant Professor. His current research interests include power devices, power converters, renewable energies (photovoltaics) and reliability of power systems.

Dr. Sébastien Jacques has more than 20 articles in reputable international journals, and authored > 25 national and international conferences and proceedings. 

About the author

Dr. René Leroy received the Ph.D. degree in mechanical engineering from University of Toulouse, Toulouse, France, in 1997. He completed the DSc in 2006 from University of Tours, Tours, France.

Dr. René Leroy is currently member of the Rheology and Mechanical Laboratory (LMR EA 2640), François Rabelais University, Tours, France. His current research interests include mechanical analysis, machining and cutting tool, wear analysis and characterization mechanics. Dr. René Leroy has > 25 articles in reputable international journals, 3 patents, and authored > 70 national and international conferences and proceedings. 

About the author

Prof. Marc Lethiecq was born in St. Jérôme, Québec, Canada in 1960. He graduated in Electrical Engineering in 1984 and received the MSc in Acoustics followed by a Ph.D degree in Non Destructive Testing in 1988, all from Institut National des Sciences Appliquées (INSA), Lyon, France.

Prof. Marc Lethiecq has been with the University of Tours since 1990, first as an assistant professor and since 1994 as full professor. Previously, between 1984 and 1987, he had been teaching and research assistant at INSA-Lyon and between 1987 and 1990 he had worked as a research engineer on ultrasonic transducers for biological and medical applications for Vermon S.A. and CNTS.

Prof. Marc Lethiecq’s research is focused on piezoelectric materials and devices for ultrasonic and energy conversion applications. He has been teaching electronics, feedback control, applied physics and courses related to his research activities since 1984 in several universities and engineering schools. In January 2012, he became director of GREMAN, a joint research laboratory between University of Tours and CNRS in partnership with CEA and ENI Val de Loire on materials, microelectronics, acoustics and nanotechnologies. He also leads FANO, a CNRS research federation on acoustics.