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S. Jacques, A. Caldeira, N. Batut, A. Schellmanns, R. Leroy, L. Gonthier
Microelectronics Reliability, Volume 52, Issue 1, January 2012
Abstract
In this paper, a physical model is proposed to estimate the TRIAC solder joint fatigue during power cycling. The lifetime prediction is based on the following assumptions: the case temperature swing (ΔTcase) is the main acceleration factor, the solder joints are the weakest materials in the non-insulated TO-220AB TRIAC package and the plastic strain within the solder layer due to shearing is the failure cause.
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