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W. Kanert
Microelectronics Reliability Volume 52, Issues 9–10, September–October 2012, Pages 2336–2341
Abstract
Active cycling of power devices, i.e. exposure to repetitive voltage and current pulses, causes power dissipation, resulting in thermo-mechanical loads that can cause different failure mechanisms. This paper focuses on degradation of the metallization. Requirements and customer expectations, using examples from automotive applications, are discussed, contrasting these with the procedures for reliability assessment and their limitations.
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