AlGaN/GaN high electron mobility transistors based on InGaN/GaN multi-quantum-well structures with photo-chemical vapor deposition of SiO2 dielectrics.

Microelectronic Engineering, Volume 104, April 2013, Pages 105-109.
Kai-Hsuan Lee, Ping-Chuan Chang, Shoou-Jinn Chang.

Nano Science Group, National Synchrotron Radiation Research Center, Hsinchu 30076, Taiwan

Department of Electro-Optical Engineering, Kun Shan University, Yung-Kang Dist., Tainan 71003, Taiwan

Institute of Microelectronics & Department of Electrical Engineering, Center for Micro/Nano Science and Technology, Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 70101, Taiwan

 

 

Abstract

 

AlGaN/GaN metal–oxide-semiconductor high electron mobility transistor (MOS-HEMT) based on InGaN/GaN multi-quantum-well (MQW) structure has been fabricated with SiO2 dielectric deposited via photo-chemical vapor deposition (PHCVD) using a deuterium lamp as the excitation source. High quality SiO2 was successfully formed by PHCVD and it exhibited exactly stoichiometric as gate oxide and passivation dielectric for MQW-based MOS-HEMT. The protection offered by the passivation of PHCVD of SiO2 may contribute to the significantly reduced current dispersion and improved RF performance. With 1-um-long gate length at drain–voltage of 10 V, it exhibited a maximum drain current Id(max) of 966 mA/mm and a peak transconductance gm(max) of 127 mS/mm, while the unity gain cutoff frequency (fT) and maximum frequency of oscillation (fmax) are 13.9 and 33.9 GHz, respectively.

 

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