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Chang-Chih Chen , Fahad Ahmed, Dae Hyun Kim, Sung Kyu Lim, Linda Milor
Microelectronics Reliability, Volume 52, Issues 9–10, September–October 2012
Abstract
Backend dielectric breakdown is one of the major sources of wearout for microprocessors. We present test data and a methodology to accurately estimate the lifetime for a microprocessor system due to backend dielectric breakdown. Our methodology incorporates activity in the nets surrounding each dielectric segment in the layout, temperature, and all layout spacings among parallel tracks. We analyze several layouts using our methodology and show the impact of backend dielectric wearout on microprocessor system lifetime.
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