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Journal of Electronic Materials, 2013, Volume 42, Issue 3, pp 545-551.
Tung-Han Chuang, Hsi-Ching Wang, Chien-Hsun Chuang, Jun-Der Lee, Hsing-Hua Tsai.
Institute of Materials Science and Engineering, National Taiwan University, Taipei, 106, Taiwan and
Wire Technology Co., LTD, Taichung, 432, Taiwan.
Author contact: e-mail: [email protected]
Abstract
An innovative Ag-8Au-3Pd bonding wire with a high twin density has been produced. The grain size of this annealing-twinned wire changes moderately during electrical stressing, unlike that of the conventional grained wire, which increases drastically and even leads to a bamboo structure. In addition, the durability against electromigration of the annealing-twinned Ag-8Au-3Pd alloy wire is higher than that of the conventional grained wire. This higher durability can be ascribed to the surface reconstruction of a stepwise morphology and slow grain growth resulting from the abundance of annealing twins in this wire.
