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Journal of Electronic Materials, 2013, Volume 42, Issue 6, pp 1063-1072.
Muhammad Nubli Zulkifli, Azman Jalar, Shahrum Abdullah, Irman Abdul Rahman, Norinsan Kamil Othman.
Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia &
Department of Mechanical & Materials Engineering, Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia &
School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia.
Abstract
We have analyzed the effects of nanoindentation at applied loads of 10 mN and 20 mN on the micromechanical properties of gold (Au) ball bonds with and without cracks. The depth profile and the plastic zone size for each indentation were determined to identify the substrate effect and its relationship with the observed micromechanical properties. The substrate effect occurred for indentations at 20 mN applied load, but did not occur near cracks for either 10 mN or 20 mN loads. Because of the substrate effect and the presence of cracks, the average hardness or yield strength decreased for indentations on Au ball bonds. Therefore, to minimize the substrate effect, an applied load of 10 mN is best for characterizing Au ball bonds.
