Advances in Engineering Advances in Engineering features breaking research judged by Advances in Engineering advisory team to be of key importance in the Engineering field. Papers are selected from over 10,000 published each week from most peer reviewed journals.
Hongxiu Zhou, Chunmei Wang, Dongjie Zhao, Honghao Zhao
The International Journal of Advanced Manufacturing Technology,Volume 60, June 2012
Abstract
Nanogrinding experiments on soft–brittle monocrystalline mercury cadmium telluride (HgCdTe, MCT) were conducted using a novel developed ceramic bond ultrafine diamond grinding wheel. The experimental results showed that the ultrafine grinding wheel exhibited excellent grinding performance on HgCdTe wafers. Surface roughness Ra 1.4 nm, rms 1.7 nm, and PV 10.9 nm were respectively achieved under nanogrinding using this diamond grinding wheel. All the ground surfaces of MCT wafers exhibited ductile mode character, free of cracking and burn damage. The nanogrinding results were discussed in terms of the ceramic bond, as well as maximum undeformed chip thickness.
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