Advances in Engineering Advances in Engineering features breaking research judged by Advances in Engineering advisory team to be of key importance in the Engineering field. Papers are selected from over 10,000 published each week from most peer reviewed journals.
Microelectronic Engineering, Volume 103, March 2013, Pages 92-98.
Ching-Jui Shih, Wei-Chih Lin, Chao-Sung Lin, Shih-Fu Ou, Yung-Ning Pan.
Department of Mechanical Engineering, National Taiwan University, Taipei 10617, Taiwan.
Nanoscience Centre, University of Cambridge, United Kingdom.
Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan.
Abstract
Micro patterning and nickel electroforming, which are commonly used in MEMS process to fabricate microstructures or micro components, were employed in this study for the fabrication of diamond conditioners. The thickness of the JSR THB-151 N resist on the stainless steel substrate can reach up to 75 um, which is sufficient for forming a mask. The diamond grits which were embedded in the nickel deposit formed microcolumns array on the substrate with the guidance of the resist mold. By using this technique, the population density of the working diamond grits in the diamond conditioner can be increased. Moreover, an extra strike nickel plating was performed to functionalize the surface of the nickel deposit for increasing the polarization of the nickel deposit which can eliminate the edge effect in the enhancement electroplating process. This fabrication process developed herein can produce diamond conditioners with improved uniformity in both distribution and protrusion control of micro column diamond cutting tips. In addition, the developed diamond conditioners exhibit an increase in material removal rate (MRR) by some 15%, while, at the same time, maintain a relatively low worn rate as compared to the commercially available conditioners.
