Advances in Engineering Advances in Engineering features breaking research judged by Advances in Engineering advisory team to be of key importance in the Engineering field. Papers are selected from over 10,000 published each week from most peer reviewed journals.
Journal of Electronic Materials, 2013, Volume 42, Issue 3, pp 359-365.
C.L. Yang, H.J. Lai, J.D. Hwang, T.H. Chuang.
Institute of Materials Science and Engineering, National Taiwan University, Taipei, 106, Taiwan and
Material and Chemical Research Laboratories, Industrial Technology Research Institute, Hsinchu, 31015, Taiwan
Abstract
Since the optimum operation temperature for GeTe thermoelectric material is about 430℃, the traditional soldering process cannot be used for the assembly of a GeTe module. In fact, the soldering method has an addition drawback in that excess molten solder can wick up the sides of TE pellets causing electrical shorts between TE couples. A novel bonding technique, called diffusion soldering, using the principle of solid-liquid interdiffusion, results in satisfactory bonding interfaces with a shear strength ranging from 12.6 MPa to 19.1 MPa. .
