Chemical Engineering

Scientific Reports 4, Article number: 5639, 2014. Bo Quan, Seung-Ho Yu, Dong Young Chung, Aihua Jin, Ji Hyun Park, Yung-Eun Sung, Yuanzhe Piao.

Applied Clay Science, Volumes 88–89, February 2014, Pages 144–150. A. Araújo, G. Botelho, M. Oliveira, A.V. Machado.

Reaction Kinetics, Mechanisms and Catalysis, February 2014, Volume 111, Issue 1, pp 89-106. Fawzi M. Elfghi, N. A. S. Amin.

ACS Applied Materials & Interfaces, 2014; 140724090802003. Tushar Kumeria, Mohammad Mahbubur Rahman, Abel Santos, Josep Ferré-Borrull, Lluís F. Marsal, Dusan Losic.

Superlattices and Microstructures, Volume 69, May 2014, Pages 226-230. Nhlakanipho Mntungwa, Pullabhotla V.S.R. Rajasekhar, Karthik Ramasamy, Neerish Revaprasadu.

Colloids and Surfaces A: Physicochemical and Engineering Aspects, Volume 442, 1 February 2014, Pages 111-122. Gemma Gutiérrez, María Matos, José M. Benito, José Coca, Carmen Pazos.

Chemical Engineering Journal, Volume 230,  2013, Pages 499-505. M.S. Ak, M. Muz, O.T. Komesli, C.F. Gökçay.

Chemical Science, 2014. Zhun Zhao, Joni Arentz, Lori A Pretzer, Pongsak Limpornpipat, James M Clomburg, Ramon Gonzalez, Neil Schweitzer, Tianpin Wu, Jeffery T. Miller, Michael Wong.

Transport in Porous Media, April 2014, Volume 102, Issue 3, pp 387-402. Douglas J. Nicolin, Regina Maria M. Jorge, Luiz Mario M. Jorge.

Chemical Engineering Science, Volume 104, 18 December 2013, Pages 250-259.  Keith M. Forward, Alexander Flores, Gregory C. Rutledge.

Scientific Reports, 4, 4605, 2014. Zachary Favors, Wei Wang, Hamed Hosseini Bay, Aaron George, Mihrimah Ozkan, Cengiz S. Ozkan.

Process Safety and Environmental Protection,  18 December 2013. Martin J. Goodfellow, Jonathan Wortley, Adisa Azapagic.

Chemical Engineering Journal, Volume 233, November 2013, Pages 242-250. KeeHong Kim, Pravin G. Ingole, JongHak Kim, HyungKeun Lee.

J. Electrochem. Soc. 2013volume 160, issue 12,D3197-D3205. Ibro Tabakovic. Steve Riemer.Ming Sun.

Chemical Engineering Journal, Volume 232,  2013, Pages 89-95. Manhong Liu, Qiang Bai, Hailian Xiao, Yanyan Liu, Jun Zhao, William W. Yu.