Advances in Engineering Advances in Engineering features breaking research judged by Advances in Engineering advisory team to be of key importance in the Engineering field. Papers are selected from over 10,000 published each week from most peer reviewed journals.
Microelectronic Engineering, 24 February 2013. Masahide Mutoh, Takashi Nagoshi, Tso-Fu Mark Chang, Tatsuo Sato, Masato Sone
Read More »Micro-compression test using non-tapered micro-pillar of electrodeposited Cu
Electrical Engineering
The distribution of elements in sequentially prepared MgB2 on SiC buffered Si substrate and possible pinning mechanisms
Applied Surface Science, Volume 269, 15 March 2013, Pages 29-32. S. Chromik, A. Nishida, V. Strbik, M. Gregor, J.P. Espinós, J. Liday, R. Durný.
Read More »FBG/DFB-induced chaotic self-mixing analysis and sensing applications
Optics & Laser Technology, Volume 50, September 2013, Pages 176-181. Daniele Tosi
Read More »Advanced computational reasoning based on the NKRL conceptual model
Expert Systems with Applications, Volume 40, Issue 8, 15 June 2013, Pages 2872-2888. Gian Piero Zarri
Read More »A new characterization technique for SOI wafers: Split C(V) in pseudo-MOSFET configuration
Solid-State Electronics, Available online 19 March 2013. A. Diab, C. Fernández, A. Ohata, N. Rodriguez, I. Ionica, Y. Bae, W. Van Den Daele, F. Allibert, F. Gámiz, G. Ghibaudo, C. Mazure, S. Cristoloveanu
Read More »Fabrication and formation of Ta/Pt-Si ohmic contacts applied to high-temperature Through Silicon Vias (TSVs)
Sensors and Actuators A: Physical, Volume 191, 1 March 2013, Pages 45-50. R. Gueye, T. Akiyama, D. Briand, N.F. de Rooij
Read More »Improving prediction of exchange rates using Differential EMD
Expert Systems with Applications, Volume 40, Issue 1, January 2013, Pages 377-384. Bhusana Premanode, Chris Toumazou
Read More »Chromatic dispersion estimation methods using polynomial fitting in PDM-QPSK or other multilevel-format coherent optical systems
Optical Fiber Technology, Volume 19, Issue 2, March 2013, Pages 162-168. Junyi Wang, Xin Jiang, Xuan He, Yi Weng, Zhongqi Pan
Read More »Mechanical properties of nickel fabricated by electroplating with supercritical CO2 emulsion evaluated by micro-compression test using non-tapered micro-sized pillar
Microelectronic Engineering, 11 February 2013. Takashi Nagoshi, Tso-Fu Mark Chang, Sato Tatsuo, Masato Sone
Read More »Memristor structures for high scalability: Non-linear and symmetric devices utilizing fabrication friendly materialsand processes
Microelectronic Engineering, Volume 103, March 2013, Pages 66-69. Janice H. Nickel, John Paul Strachan, Matthew D. Pickett, C. Tom Schamp, J. Joshua Yang, John A. Graham, R. Stanley Williams.
Read More »Annotating mobile phone location data with activity purposes using machine learning algorithms
Expert Systems with Applications, Volume 40, Issue 8, 15 June 2013, Pages 3299-3311. Feng Liu, Davy Janssens, Geert Wets, Mario Cools
Read More »Laser-assisted ultrathin die packaging: Insights from a process study
Microelectronic Engineering, Volume 101, January 2013, Pages 23-30. Val R. Marinov, Orven Swenson, Yuriy Atanasov, Nathan Schneck
Read More »Interface engineering of Ge using thulium oxide: Band line-up study
Microelectronic Engineering, Volume 109, September 2013, Pages 204-207 I.Z. Mitrovic, M. Althobaiti, A.D. Weerakkody, N. Sedghi, S. Hall, V.R. Dhanak, P.R. Chalker, C. Henkel, E. Dentoni Litta, P.-E. Hellström, M. Ostling
Read More »Molecular simulation of pattern formation in electron beam lithography
Microelectronic Engineering, 30 March 2013. Masaaki Yasuda, Hirofumi Sakai, Rina Takai, Hiroaki Kawata, Yoshihiko Hirai
Read More »A fuzzy logic based approach for modeling quality and reliability related customer satisfaction in the automotive domain
Expert Systems with Applications, Volume 40, Issue 2, 1 February 2013, Pages 800-810. Rahul Chougule, Vineet R. Khare, Kallappa Pattada
Read More »Robust ear based authentication using Local Principal Independent Components
Expert Systems with Applications, 11 May 2013. Mamta , Madasu Hanmandlu
Read More »Inductively Coupled Plasma etching of amorphous silicon nanostructures over nanotopography using C4F8/SF6 chemistry
Microelectronic Engineering, 13 March 2013 Patrick Harvey-Collard, Abdelatif Jaouad, Dominique Drouin, Michel Pioro-Ladrière
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